Think System SR860 V2 Specifications
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| Brand |
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| Model |
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| Processor |
- Two or four 3rd Generation Intel® Xeon® Processor Scalable family CPUs up to 250W; Mesh topology with 6x UPI links
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| Memory |
- Up to 12TB in 48x slots using 256GB DDR4 DIMMs; Intel® Optane™ PMem 200 Series
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| GPU |
Supports 8x high-performance GPUs:
- 8x NVIDIA HGX™ H100/H200/B200 GPUs with NVLink interconnects at up to 1.8TB/s
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| I/O Expantions |
Up to 10x PCIe Gen5 x16 FHHL adapters
- 8x in front connected to PCIe switch for GPU connectivity
- 2x in rear connected to CPU for CPU connectivity
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| Power Supply |
- Up to 8x hot-swap power supplies, allowing full N+N redundancy
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| Form Factor |
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| Rail Kit |
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| Storage Capacity |
- Up to 48x 2.5″ hot-swap NVMe SSDs
- Up to 2x non-hot swap M.2 for boot (RAID via VROC)
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| Number of Processors Supported |
- 4 x3th Gen Intel® Xeon® Scalable processors.
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| Total Memory Slots |
|
| Maximum Memory Supported |
- DDR4 DIMMs with maximum frequency at 4300MHz
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| Cooling |
- Air-cooled with N+1 hot-swap fan solution
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| Management |
- XClarity Controller2 (XCC2), which provides advanced service-processor control, monitoring, and alerting functions. The XCC2 consolidates the service processor functionality, super I/O, video controller, and remote presence capabilities into a single chip on the server system board.
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| OS Support |
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| Operating Temperature |
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| Warranty |
- 1- and 3-year customer replaceable unit and onsite service, next business day 9×5, optional service upgrades
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| Datasheet |
Lenovopress.com/ds0180 |