Lenovo ThinkSystem SR860 V3,5th Gen Intel® Xeon®,32x DDR5, up to 4TB.

ThinkSystem SR860 V3 Specifications

• Lenovo

• SR860 V3

• Two or four 4^th Gen Intel^® Xeon^® Scalable processors, up to 350W Mesh topology with 3x UPI links; With Up to 4x QAT, DLB, IAA and DSA Accelerators

• Up to 16TB of TruDDR5 memory in 64x slots; Memory speeds up to 4800MHz.

• Up to 4x double-width 350W GPUs or 8x single-width 75W GPUs

• Up to 16x (12x Gen5 + 4x Gen4) or up to 18x Gen4 or 4x Gen4 PCIe expansion slots
• Front: VGA, 1x USB 3.1, 1x USB 2.0
• Rear: 2x USB 3.1, Serial port, VGA port, 1GbE dedicated management port

• Up to 4x Platinum or Titanium hot-swap power supplies; N+N redundancy supported

• 4U Rack

• Up to 48x 2.5″ drives; Supports up to 24x direct connection NVMe drives; 2x 7mm or 2x M.2 drives for boot

• 2 Dedicated OCP 3.0 slot supporting 1GbE, 10GbE, 25GbE or 100GbE

• PFA; hot-swap/redundant drives and power supplies; redundant fans; internal light path diagnostic LEDs; front-access diagnostics via dedicated USB port; optional External Diagnostics Panel Handset with LCD display

• Root of Trust (RoT) module includes Platform Firmware Resiliency (PFR), Trusted Platform Module (TPM) 2.0 or TCM for PRC and optional Chassis Intrusion Switch. Secures and authenticates the system to prevent unauthorized intrusion.

• Support for ThinkSystem PCIe RAID/HBA cards

• Air-cooled with N+1 hot-swap fan solution

• Lenovo XClarity Controller; Redfish support

• Microsoft, Red Hat, SUSE, VMware. Visit lenovopress.com/osig for more information

• 10°C to 55°C

• 1- and 3-year customer replaceable unit and onsite service, next business day 9×5, optional service upgrades